CarboTherm™ Boron Nitride powders offer the unique combination of high thermal conductivity and dielectric strength in one material. Today's smaller, hotter, and faster electronic assemblies require greater heat dissipation than ever before. Polymers filled with CarboTherm powders solve these problems in a wide variety of applications.
When used as a cooling filler in a variety of resin systems, CarboTherm powder is unmatched where application requires good heat dissipation, low dielectric loss, and low thermal expansion.
Thermal conductivity of single crystal CarboTherm is >300 W/mK. Thermal conductivity of about 95% dense polycrystalline granules is >125 W/mK. Overall thermal conductivity of a CarboTherm filled resin matrix in a given application and processing parameters will depend on the inherent thermal conductivity of the resin, filler packing density, particle-to-particle interfacial contact, as well as material composition.
CarboTherm™ powder is available in a variety of platelets, agglomerates and spherical grades. Comprised of BN crystals in a range of density / porosity, CarboTherm agglomerates or spheres offer more efficient particle packing due to granular morphology and less interfacial resistance due to coarse low density grains. These are typically used where z-plane thermal conductivity is required. CarboTherm platelets, on the other hand, with platy lamellar structure similar to graphite, tend to align with the direction of flow in polymer processing, making it best fit for heat spreading applications.