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Thermal Management Powders

CarboTherm™ BN Cooling Fillers

CarboTherm Boron Nitride Thermal Fillers | Saint-Gobain

CarboTherm™ Boron Nitride powders offer the unique combination of high thermal conductivity and dielectric strength in one material. Today's smaller, hotter, and faster electronic assemblies require greater heat dissipation than ever before. Polymers filled with CarboTherm powders solve these problems in a wide variety of applications.

When used as a cooling filler in a variety of resin systems, CarboTherm powder is unmatched where application requires good heat dissipation, low dielectric loss, and low thermal expansion.

Thermal conductivity of single crystal CarboTherm is >300 W/mK.  Thermal conductivity of about 95% dense polycrystalline granules is >125 W/mK.  Overall thermal conductivity of a CarboTherm filled resin matrix in a given application and processing parameters will depend on the inherent thermal conductivity of the resin, filler packing density, particle-to-particle interfacial contact, as well as material composition.

  • Features & Benefits
  • Available Grades
CarboTherm™ Boron Nitride powders are inert, white ceramic materials featuring a platey, hexagonal crystal structure that offers certain benefits:
 
  • High thermal conductivity for efficient heat dissipation from component assemblies
  • Low density, light weight properties for higher filling and lower total cost of fillers
  • Low dielectric constant for guaranteed performance of electronic devices
  • High lubricity reduces wear and tear of processing equipment
  • Non-abrading properties enable gentle handling of critical electronic components

CarboTherm™ powder is available in a variety of platelets, agglomerates and spherical grades.  Comprised of BN crystals in a range of density / porosity, CarboTherm agglomerates or spheres offer more efficient particle packing due to granular morphology and less interfacial resistance due to coarse low density grains. These are typically used where z-plane thermal conductivity is required. CarboTherm platelets, on the other hand, with platy lamellar structure similar to graphite, tend to align with the direction of flow in polymer processing, making it best fit for heat spreading applications.

  • CarboTherm Platelet Powders are well suited for polymers that utilize low or high shear processing and are often utilized in cost demanding applications. 
  • CarboTherm Low Density Agglomerated Powders are well suited to thermoset polymers that utilize low shear processing and provide isotropic thermal performance.
  • CarboTherm High Density Agglomerated Powders are well suited to thermoset polymers that utilize moderate shear processing, provide isotropic thermal performance and enable high filler loadings.
  • CarboTherm Spherical Powders are designed for thermoset polymers that utilize low shear processing where the highest thermal performance is required.

Related Applications & Technical Solutions

  • Dielectric at High Frequencies
  • Electronic Cooling
  • Cooling Fillers for Thermally Conductive Plastics
  • Understanding Anisotropy
  • Particle Shape Considerations
  • Surface Properties
  • Boron Nitride

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