Low Loss Dielectric Filler Powder & Components
In various areas in industry, telecommunication, scientific research and medical technology, components are needed that are subject to high-frequency fields. A combination of low dielectric constant, low loss and high dielectric strength over a large range of frequencies make boron nitride an ideal choice where high-frequency fields are present.
|Ω cm, 25°C
Our line of powder products are popular as low loss fillers for rigid and flexible copper clad laminates (CCL), prepregs and bondply adhesives. Traditionally used as a thermal filler for thermal interface materials (TIMs), the combination of BN's thermal and dielectric properties make it attractive for low loss electronic assemblies where electromagnetic transparency is required.
COMBAT® Machinable Ceramics are a popular solution for hardware that will avoid signal or energy loss in high frequency systems. Grade AX05 is a great alternative to pyrolytic boron nitride, which is often used in chemical vapor deposition (CVD) and physical vapor deposition (PVD) systems. Boron nitride is naturally resistant to plasma sputtering, extending the life of components in plasma environments like CVD or PVD.
Grades M & M26, which benefits from the combination of silica and boron nitride, have improved mechanical properties and a lower dielectric constant than pure BN. These grades are uniquely suited for high frequency applications, especially when components are exposed to vibrations or other mechanical stresses. These grades are popular as microwave windows, antenna covers, or radomes where temperatures are too high for traditional solutions to work. Grade M in particular has gained attention in aerospace as a solution for systems that need to function at hypersonic speeds.