Cooling Fillers for Thermally Conductive Plastics
Thermally conductive plastics are a growing solution to lightweighting in power electronics, LED assemblies and other mobile electronic systems. Traditional carbon-based fillers, like graphite or carbon black, are popular to enhance thermal conductivity and mechanical properties of plastics, but they fall short where electrical isolation is required.
Boron nitride offers a unique value proposition as a filler by introducing thermal conductivity into thermoplastic compounds, while maintaining and even enhancing the electrically isolating properties inherent of plastics. Additionally, the translucent, white appearance of boron nitride powder allows colorants to work effectively to adjust the resin appearance.
Boron nitride is well known for its high thermal conductivity, but can present challenges in processing due to poor flowability and impact on plastic mechanical properties.
Our flowable platelet offering presents a unique solution for the thermoplastics industry. These loosely agglomerated particles present the following benefits:
- Enhanced flowability for feeding compounding equipment without bridging
- Improved dispersion characteristics as the agglomerates are designed to break down during compounding and extrusion
- Superior thermal performance from large, crystalline primary platelets - 12 µm (FP12) or 30 µm (FP30)
- Competitive cost position versus traditional BN platelets or agglomerates