Standard Platelets
High purity platelets with a tight particle size distribution
Standard Platelet, or "SP", powders consist of high-quality crystalline flakes of boron nitride. These powders have outstanding purity, no agglomeration and a tight particle size distribution around the D50. The product names include "SP", followed by the d50 average particle size for that grade.
- High aspect ratio allows for percolation at low loading levels as a filler particle
- High purity & crystallinity make SP grades ideal for lubrication enhancement
- Best option for application where tight particle size control and fine particles are required
Grade | D10 | D50 | D90 | Tap Density | Surface Area | BN Content | B2O3 | O2 |
---|---|---|---|---|---|---|---|---|
µm | µm | µm | g/cm3 | m2/g | % | % | % | |
SP1 | 0.3 | 1.2 | 3.5 | 0.20 | 18 | 98.2 | 0.15 | 1.7 |
SP2 | 0.6 | 2.2 | 4.2 | 0.20 | 12 | 98.6 | 0.06 | 1.3 |
SP5 | 3.3 | 5.5 | 10 | 0.30 | 9.0 | 99.3 | 0.10 | 0.6 |
SP6 | 3.9 | 6.5 | 12 | 0.45 | 8.0 | 99.6 | 0.04 | 0.4 |
SP8 | 4.2 | 8.5 | 19 | 0.45 | 2.8 | 99.3 | 0.02 | 0.7 |
SP12 | 6.0 | 12 | 23 | 0.50 | 1.8 | 99.3 | 0.02 | 0.7 |
SP16 | 7.4 | 16 | 29 | 0.50 | 1.6 | 99.4 | 0.02 | 0.6 |
SP30 | 14 | 30 | 50 | 0.55 | 1.1 | 99.7 | 0.02 | 0.3 |
- Dielectric thermal filler
- Potting compound
- Polymer processing aid
- Lubricant additive
- Mold release
- Nucleation aid
- Cosmetic formulations
Boron nitride powders enhance both dielectric and thermal performance of composites
Boron nitride enhances the thermal & electrical properties of thermoplastics as a filler
Boron nitride is an effective polymer processing aid (PPA) for polyolefin film extrusion
BN can be added to liquid lubricants or used on its own as a solid lubricant
Low loss filler powders are critical for manufacturers of flex and rigid copper clad laminates (CCLs) for high-speed circuits in 5G networks.