Thermal Interface Materials
In designing the electronic devices, heat build-up is most often the limiting factor. Combining high thermal conductivity with excellent dielectric strength, CarboTherm™ thermal management fillers for thermal interface materials such as - gap fillers, gap pads, epoxies and potting compounds, phase-change materials, thermal greases, adhesives - offer the most optimized solution for the hottest applications.
With its low density and light weight properties, CarboTherm lowers the total filler. In addition, CarboTherm, in a polymer matrix, also protects critical electronic components due to its non-abrading properties.