Electronic Applications
With the prevalence of power electronic products such as LED lighting modules, power supplies and amplifiers, the efficiency of thermal design of all components within an electronic assembly has become increasingly more important.
At PCB levels, thermal constraint arises from the thermal conduction of the dielectric materials. Due to its intrinsically high thermal conductivity, Boron Nitride's CarboTherm™ Thermal Fillers maximizes the formation of conductive paths in filled epoxys for PCB laminates.