Solutions for Electronic Cooling
Thermal interface materials (TIM) represent an increasingly important role in electronics manufacturing, performance and reliability. The single most frequent failure mode of electronic devices is heat. Thermal interface materials are designed to minimize the impact of heat in electronic systems even as the power and heat generation increases. Below are the typical forms TIM materials are produced in.
Saint-Gobain boron nitride can play an important role in these TIM materials by controlling key properties of BN powder to meet the thermal, electrical and rheological demands of the application.