Cooling Fillers for Thermally Conductive Plastics
Thermally conductive plastics present a growing market in a demanding world of high power electronics and weight reduction for more energy efficient systems. Commonly used carbon based fillers, while imparting thermal conductivity to thermoplastic polymers, alter the electrical properties, hence rendering them useless in applications that require thermally conductive, but electrically isolating plastics.
Boron nitride offers a unique value proposition as a filler by introducing thermal conductivity into thermoplastic compounds, while maintaining and even enhancing the electrical isolative properties inherent of plastics. Additionally, translucent, white appearance of CarboTherm™ Boron Nitride fillers is conducive to addition of colorants into the resin formulation.
Boron nitride is well known for its high thermal conductivity, but can present challenges in this market due to its higher cost, degradation of mechanical strength and poor flowability in powder form.
PCTP30D, a hybrid BN powder option, offers a unique combination of large BN platelets, agglomerated by a 2% inorganic binder in a flowable powder form. This combination of properties meets several key challenges of the thermoplastic market.
- It is agglomerated into particles that offers good flowability for maximum throughput rates in the mixing and compounding process.
- It offers a binder system that more readily bonds with the resin systems than pure BN offering enhanced mechanical characteristics of the final part.
- It provides large BN platelets in an agglomerated form that offers higher thermal conductivity at lower loading levels, thereby reducing the overall cost of manufacturing the thermally conductive plastic.
- Lastly, PCTP30D offers a competitive cost position for this very cost sensitive market.
Saint-Gobain PCTP30D boron nitride powder offers an advanced combination of properties to help you succeed in meeting your toughest thermally conductive plastic requirements.