Thermally conductive plastics present a growing market in a demanding world of high power electronics and weight reduction for more energy efficient systems. Commonly used carbon based fillers, while imparting thermal conductivity to thermoplastic polymers, alter the electrical properties, hence rendering them useless in applications that require thermally conductive, but electrically isolating plastics.
Boron nitride offers a unique value proposition as a filler by introducing thermal conductivity into thermoplastic compounds, while maintaining and even enhancing the electrical isolative properties inherent of plastics. Additionally, translucent, white appearance of CarboTherm™ Boron Nitride fillers is conducive to addition of colorants into the resin formulation.
Boron nitride is well known for its high thermal conductivity, but can present challenges in this market due to its higher cost, degradation of mechanical strength and poor flowability in powder form.
PCTP30D, a hybrid BN powder option, offers a unique combination of large BN platelets, agglomerated by a 2% inorganic binder in a flowable powder form. This combination of properties meets several key challenges of the thermoplastic market.
Saint-Gobain PCTP30D boron nitride powder offers an advanced combination of properties to help you succeed in meeting your toughest thermally conductive plastic requirements.