Saint-Gobain's Combat® Boron Nitride Machinable Ceramic Components feature a unique combination of properties that make them an exceptional choice uses such as shields and insulators used in Cathode-Arc deposition systems.
CarboTherm™ Boron Nitride fillers offer thermal management solutions for the electronic industry where efficient heat management is the key to enhancing the life and efficiency of electronic devices. CarboTherm is used as additives in thermal interface materials as well as thermally conductive plastics.
Heat generation is a major problem with LED bulbs, reducing the efficiency and life expectancy of the assembly if not managed properly. Filled with CarboTherm™ thermal management fillers, thermally conductive plastics can now be injection molded and used at the die, board and enclosure levels to effectively dissipate heat, enhance output, and increase lifetime of LED bulb assemblies.
CarboTherm boron nitride fillers' low coefficient of thermal expansion helps replace metal or ceramic parts in dimensionally critical applications such as LED enclosures, while enhancing the electrical isolation of the plastic. CarboTherm is compatible with a variety of resin systems, giving plastic compounders ease and flexibility to fit CarboTherm thermal management fillers into their existing resin matrix.
With the prevalence of power electronic products such as LED lighting modules, power supplies and amplifiers, the efficiency of thermal design of all components within an electronic assembly has become increasingly more important.
At PCB levels, thermal constraint arises from the thermal conduction of the dielectric materials. Due to its intrinsically high thermal conductivity, Boron Nitride's CarboTherm™ Thermal Fillers maximizes the formation of conductive paths in filled epoxys for PCB laminates.
Combat® Boron Nitride Machinable Ceramic Components feature a unique combination of properties that make them an exceptional choice uses such as shields and insulators used in Cathode-Arc deposition systems. It is easily machined, allowing to meet the complex design specifications. It is virtually thermal-shock-proof, allowing the chambers to be opened quickly. Its inherent lubricity permits easy and regular cleaning. Find a fit for your unique application from a variety of grades available from Saint-Gobain.
For a number of years, Saint-Gobain has also supplied its Combat® BN Grade AX05 Insulators to the many Leybold APS units around the world. An outstanding Coating Machine, the Leybold Advanced Plasma System can consume its insulators at a high rate. Leybold APS operators know and rely on Grade AX05, coating after coating, delivering high yields with no unscheduled downtime.
Thermal Interface Materials
In designing the electronic devices, heat build-up is most often the limiting factor. Combining high thermal conductivity with excellent dielectric strength, CarboTherm™ thermal management fillers for thermal interface materials such as - gap fillers, gap pads, epoxies and potting compounds, phase-change materials, thermal greases, adhesives - offer the most optimized solution for the hottest applications.
With its low density and light weight properties, CarboTherm lowers the total filler. In addition, CarboTherm, in a polymer matrix, also protects critical electronic components due to its non-abrading properties.