Boron Nitride Products

CARBOTHERM™ Thermal Fillers

CarboTherm TM BN Thermal Fillers

The best choice for today's electronic cooling and plastic applications



CarboTherm Fillers

CarboTherm Boron Nitride powders offer the unique combination of high thermal conductivity and dielectric strength...in one material. Today's smaller, hotter, and faster electronic assemblies require greater heat dissipation than ever before. Polymers filled with CarboTherm powders solve these problems in a wide variety of applications.
 
CarboTherm Boron Nitride is unmatched when it comes to high thermal conductivity, low dielectric loss, and low thermal expansion. In fact, it has the highest thermal conductivity of any commercial electrical insulator in polymer systems.

 

Features and Benefits

CarboTherm Boron Nitride powders are inert, white ceramic materials featuring a platey, hexagonal crystal structure that offers certain benefits:

  • Low dielectric
  • High thermal conductivity
  • Stable (non-oxidizing)
  • Non-abrading
  • Lubricious
  • Non-toxic
  • Temperature resistant

 

Thermal Conductivity

The inherent thermal conductivity of the material itself is the first factor to consider in thermal design of a particulate system and it depends upon how the powder is packed in a finished product. Each and every application has its unique processing and therefore individual packing character. For a given material, the number of particle-to-particle interfacial contacts between two heat transfer surfaces and the material composition.

 

Thermal Conductivity of CarboTherm TM  single crystal

> 300 W/mK

Thermal Conductivity of CarboTherm TM  polycrystalline solid, 95% dense

> 125 W/mK

 

 

Please feel free to contact our facility. Our application department will gladly share more detailed information with you.

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Existing order followup or to place an order 

  • Customer Service phone +1 (716) 691-2051
  • Customer Service fax +1 (716) 691-2090

Technical assistance 

  • Product/Applications +1 (716) 691-2052
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Technical questions can be sent via email to